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SHENZHEN TEPCO ELECTRONIC EQUIPEMENT CO., LTD.

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E-mail:zyzhang@topsmt.com


ASM Siplace X3 S

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ASM Siplace X3 S

  • Classification:Siplace

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SIPLACE X3 S Parameters

 

Gantries: 3

IPC performance: 78,100 cph

SIPLACE benchmark performance: 93,750 cph

Theoretical performance: 127,875 cph

Machine dimension (L x W): 1.9 x 2.3 m

Pickup rate: ≥ 99,95%

DPM rate: ≤ 3dpm

 

Conveyor

Conveyor type

Single conveyor

Flexible dual conveyor

PCB   size

Standard

50 x   50 mm - 450 x 560mm

50 x   50 mm - 450 x 320mm

Long   board option

50 x 50   mm - 850 x 560mm

50 x 50   mm - 850 x 560mm

PCB   thickness

0.3 -   4.5 mm (other sizes can be customized)

PCB weight

Max.   3.0 kg

Max.   2.0 kg

Conveyor mode: synchronous mode, asynchronous mode

 

Placement head: Siplace SpeedStar, Siplace MultiStar, Siplace TwinStar

Siplace SpeedStar (C&P20 P)

Camera

Type   23 (high-resolution camera)

Type   41 (high-resolution camera)

Component spectrums

01005   to 2220, Melf, SOT, SOD

03015   mm to 2220, Melf, SOT, SOD, Bare-Die, Flip-Chip

Placement   accuracy

(Siplace   benchmark value)

± 36   µm/3s

± 36   µm/3s

Angular accuracy

± 0.5°   / 3s

± 0.5°   / 3s

Max. component   height

4 mm

4 mm

Placement force

1.3 -   4.5 N

1.3 -   4.5 N

Illumination   level

5

5

 

Siplace MultiStar (CPP)

Camera

Type   30 (high-resolution camera)

Type   33 (stationary fine-pitch camera)

Component spectrums

01005   mm to 27 mm x 27 mm

0402 to   50 mm x 40 mm

Placement   accuracy

(Siplace   benchmark value)

± 41   µm/3s

± 34   µm/3s

Angular accuracy

01005   mm to 6 mm x 6 mm

6 mm x   6 mm to 27 mm x 27 mm

± 0.2°   / 3s

± 0.5°   / 3s

± 0.4°   / 3s

Installation position

Low

High

High

Max.   component height

6.0 mm

8.5 mm

11.5   mm

Placement force

1.0 -   10 N

1.0 -   10 N

Illumination   level

5

6

 

Siplace TwinStar (TH)

Camera

Type   33 (stationary fine-pitch camera)

Type   25 (Stationary flip-chip camera)

Component spectrums

0402 to   SO, PLCC, QFP, BGA, special components, bare dies, flip-chips

0201 to   SO, PLCC, QFP, sockets, plugs, BGA, special components, bare dies,   flip-chips, shields

Placement   accuracy

(Siplace   benchmark value)

± 26   µm / 3s

± 22   µm / 3s

Angular accuracy

± 0.05°   / 3s

± 0.05°   / 3s

Max.   component height

25 mm   (higher available on request)

25 mm   (higher available on request)

Placement force

1.0 N -   15 N

1.0 N -   15 N

Illumination   level

6

6

 

Component supply and feeder modules

Feeder slots: 160 8-mm X tape feeder modules

Component Supply:       

SIPLACE component trolley X, SIPLACE Matrix Tray Changer (MTC), Wafflepack Changer (WPC5/WPC6), SIPLACE JTF-S/JTF-M, X tape feeder modules

Alternative feeder module types:

Tray holders, linear vibratory feeders, application-specific OEM feeders

 


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