SHENZHEN TOPQUALITY INDUSTRIAL
Contacts：Zhang +86-15811551336
E-mail：zyzhang@topsmt.com
Gantries: 4
IPC performance: 105,000 cph
SIPLACE benchmark performance: 125,000 cph
Theoretical maximum output performance: 170,500 cph
Machine dimension (L x W): 1.9 x 2.3 m
Pickup rate: ≥ 99,95%
DPM rate: ≤ 3dpm
Conveyor
Conveyor type | Single conveyor | Flexible dual conveyor | |
PCB size | Standard | 50 x 50 mm - 450 x 560mm | 50 x 50 mm - 450 x 320mm |
Long board option | 50 x 50 mm - 850 x 560mm | 50 x 50 mm - 850 x 560mm | |
PCB thickness | 0.3 - 4.5 mm (other sizes can be customized) | ||
PCB weight | Max. 3.0 kg | Max. 2.0 kg | |
Conveyor mode: synchronous mode, asynchronous mode
Placement head: Siplace SpeedStar, Siplace MultiStar, Siplace TwinStar
Siplace SpeedStar (C&P20 P) | ||
Camera | Type 23 (high-resolution camera) | Type 41 (high-resolution camera) |
Component spectrums | 01005 to 2220, Melf, SOT, SOD | 03015 mm to 2220, Melf, SOT, SOD, Bare-Die, Flip-Chip |
Placement accuracy (Siplace benchmark value) | ± 36 µm/3s | ± 36 µm/3s |
Angular accuracy | ± 0.5° / 3s | ± 0.5° / 3s |
Max. component height | 4 mm | 4 mm |
Placement force | 1.3 - 4.5 N | 1.3 - 4.5 N |
Illumination level | 5 | 5 |
Siplace MultiStar (CPP) | |||
Camera | Type 30 (high-resolution camera) | Type 33 (stationary fine-pitch camera) | |
Component spectrums | 01005 mm to 27 mm x 27 mm | 0402 to 50 mm x 40 mm | |
Placement accuracy (Siplace benchmark value) | ± 41 µm/3s | ± 34 µm/3s | |
Angular accuracy | 01005 mm to 6 mm x 6 mm | 6 mm x 6 mm to 27 mm x 27 mm | ± 0.2° / 3s |
± 0.5° / 3s | ± 0.4° / 3s | ||
Installation position | Low | High | High |
Max. component height | 6.0 mm | 8.5 mm | 11.5 mm |
Placement force | 1.0 - 10 N | 1.0 - 10 N | |
Illumination level | 5 | 6 | |
Siplace TwinStar (TH) | ||
Camera | Type 33 (stationary fine-pitch camera) | Type 25 (Stationary flip-chip camera) |
Component spectrums | 0402 to SO, PLCC, QFP, BGA, special components, bare dies, flip-chips | 0201 to SO, PLCC, QFP, sockets, plugs, BGA, special components, bare dies, flip-chips, shields |
Placement accuracy (Siplace benchmark value) | ± 26 µm / 3s | ± 22 µm / 3s |
Angular accuracy | ± 0.05° / 3s | ± 0.05° / 3s |
Max. component height | 25 mm (higher available on request) | 25 mm (higher available on request) |
Placement force | 1.0 N - 15 N | 1.0 N - 15 N |
Illumination level | 6 | 6 |
Component supply and feeder modules
Feeder slots: 160 8-mm X tape feeder modules
Component Supply:
SIPLACE component trolley X, SIPLACE Matrix Tray Changer (MTC), Wafflepack Changer (WPC5/WPC6), SIPLACE JTF-S/JTF-M, X tape feeder modules
Alternative feeder module types:
Tray holders, linear vibratory feeders, application-specific OEM feeders
E-mail：zyzhang@topsmt.com
Contacts：Zhang +86-15811551336
website：：www.semismt.cn
