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Wafer Sputtering – Apollo 300

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Wafer Sputtering – Apollo 300

  • Classification:Semiconductor

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Wafer Sputtering – Apollo 300

PVD 200-300 mm Wafer Processing

Applications

  • Configurable for up to 5 metals

  • UBM/RDL

  • Fan Out

  • RF Filters

  • Power Devices

Features

  • True Bridge tool capability: Size Change

  • Degas/Anneal

  • ICP/CCP Etch

Substrates

  • 200 and 300 mm wafers

  • Warped and heavy wafer processing

  • Silicon, EMC, RCP, Glass, Bonded


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