Newly-designed low-height lid is adopted on Heller 1936 MK7, simplifying the operation and maintenance, reducing the temperature of the surface, and saving energy.

The vertical curing oven developed by Heller is available to replace the traditional oven to achieve in-line vertical automation of the epoxy cure process. The vertical format optimizes floor space and keeps the temperature stable. Different from the traditional curing oven, vertical curing oven can produce automatically, while its temperature uniformity is significantly better than the traditional one. The main application of the vertical curing oven includes chip-placing, chip-flipping, glue-underfilling, COB-packaging, etc..

INDUSTRY 4.0 Compatibility 

•Internet of Manufacturing (IoM) —Smart factories, intelligent machines and networked processes through the use of cyber-physical systems

•Central control system

•Product datas: the number of produced PCB, process parameters, production time and down time

•MTBF/MTTA/MTTR management

•Resource management and control system

•Traceability data of the product

Heller Adapts to multiple management system, while supporting related ports:

-CFX (AMQP MQTT)

-Hermes

-Pana CIM

-Fuji Smart Factory

-ASM

-other systems can be customized on request

Heller exclusive energy management software is adopted to optimize consumption intelligently, where the air-exhausting can be programmed depending on the production condition (full load, underload, empty), saving energy up to 10% - 20%.

Heller in-line vacuum reflow oven is capable of automatic high-volume vacuum soldering production, reducing the cost. Inner vacuum module enable it to pump down in 5 steps, assuring voidless soldering (void rates < 1%). The temperature profile of traditional oven can be adopted in the vacuum reflow oven.

Features:

 • Applies multi-zones to suit various thermal profile requirements

 • Able to achieve < 1% total void area spec 

 • Provides optimized cycle (average 30~60s) to achieve high UPH

 • Utilizes advanced pumping package for fast pump down time 

 • Adopts high efficient flux collection system to eliminate flux condensation 

Dimensions:590 cm x 135 cm x 160 cm

Heating Zones:12”x10”

Cooling Zones:12”x3”

The world's best reflow furnace, lead-free application, low furnace height, simple maintenance, energy saving and nitrogen saving, standard Cpk software, enhanced heating module, super cooling capacity, Profile one step in place.